COB P1.25 LED Display Module

Features

Ultra-HD Resolution with Fine Pixel Pitch
P1.25 pixel pitch delivers exceptional detail and sharpness for close-up viewing, ideal for environments where image precision is critical.

Flip-Chip COB Technology
Utilizes full flip-chip LED packaging with no wire bonding, offering lower thermal resistance, higher stability, no ghosting or “caterpillar” effect, and reduced power consumption.

Matte Anti‑Glare Surface with High Contrast
Nano-epoxy encapsulation ensures deep black uniformity and consistent color. The matte finish eliminates reflections, enhances contrast, and provides comfortable, eye-friendly viewing even under bright lighting.

High Protection & Durability
Rated dust-proof, moisture-resistant, impact-resistant, and anti-static, with a 4H-hard washable surface. Significantly reduces damage and dead pixels during transport, installation, and operation.

Low Dead Pixel Rate & High Refresh Performance
Direct chip-on-PCB packaging improves heat dissipation and avoids high-temperature reflow damage. Combined with high-yield manufacturing, it ensures smooth motion, vivid colors, and true-to-life imagery.

Standard Modular Design (150*168.75mm)
Features universal mounting holes, low-voltage drive, low power consumption, and cool operation for easy integration, scalability, and maintenance.

Soft & Uniform Surface Light Output
Converts point light into a seamless surface light source, eliminating pixel grain and moiré patterns. Delivers refined and gentle visuals that remain comfortable to view even during extended close-range use.

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